BVP Flex
BVP Flex
Product Features | Overview | Technical Specifications
Broadband Voice Enhancement Platform Ditech’s Broadband Voice Processor (BVP) Flex adds a new dimension in voice quality improvement for telecommunications service providers. Supporting “any-to-any” OC-3, DS-3, and STS-1 connectivity as well as STM-1 to STM-1 connectivity, BVP Flex allows operators to mix and match multiple interface types on the same platform, without the need for external multiplexing equipment. With a series of processing power options, the BVP Flex platform supports a wide range of Ditech’s Hybrid Echo Cancellation (HEC), Voice Quality Assurance (VQA™), and Experience Intelligence™ (EXi) solutions or multiple network topologies, all of which are manageable from a single, easy-to-use, local and remote management system. |
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| Product Features |
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| Applications |
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Performance and Cost Optimization
Ditech’s BVP Flex enables carriers to optimize
performance and to reduce the cost of their voice networks
by eliminating low-density echo cancellation equipment and expensive
multiplexing gear. With the BVP Flex’s “any-to-any” connectivity,
carriers can reclaim central office space and preserve their
investment in electrical DSX/DACS ports while migrating to OC-3 at no additional cost.
Range of Platform Options
Ditech’s Voice Quality software suite for the
BVP Flex offers a range of application-specific packages to
meet the needs of any network. The BVP Flex hardware and software are
matched to application requirements, providing a “custom tailored”
solution for specific carrier needs.
Future-Proof Platform
As voice technologies and central office connectivity requirements change,
the BVP Flex can be reconfigured or upgraded while in-service to
adapt to new requirements. Simplified remote management eliminates the
time and expense of performing costly onsite configuration, maintenance,
and upgrades. The BVP Flex is backed by a dedicated Ditech support team providing 24 x 7 service.
Narrowband Connectivity Options
For added flexibility and easy retrofit of outdated narrowband
echo cancellation equipment, Ditech’s BVP Flex platform can be installed
with DS-1 interface options that interconnect with existing DSX/DACS
equipment and cabling.
Platform Options
| BVP FLEX f600 SYSTEM | |
| 2 Telco Flex cards 4 ECR Flex cards with 6 DSP modules |
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| Power Consumption | Per Telco Flex card: 22W Per ECR Flex card: 38W Full shelf of 3 systems, fans: 660W (13.8A @ –48VDC) |
| BVP FLEX f400 SYSTEM | |
| 2 Telco Flex cards 4 ECR Flex cards with 4 DSP modules |
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| Power Consumption | Per Telco Flex card: 22W Per ECR Flex card: 29W Full shelf of 3 systems, fans: 555W (11.6A @ –48VDC) |
| BVP FLEX f200 SYSTEM | |
| 2 Telco Flex cards 4 ECR Flex cards with 2 DSP modules |
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| Power Consumption | Per Telco Flex card: 22W Per ECR Flex card: 20W Full shelf of 3 systems, fans: 450W (9.4A @ –48VDC) |
| BVP FLEX f100 SYSTEM | |
| 2 Telco Flex cards 4 ECR Flex cards with 1 DSP module |
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| Power Consumption | Per Telco Flex card: 22W Per ECR Flex card: 16W Full shelf of 3 systems, fans: 400W (8.3A @ –48VDC) |
| DS-3 INTERFACE | |
| Line Rate | DS-3 at 44.736 Mbps |
| DS-3 Framing | M13 or C-Bit |
| DS-1 Payload Framing | SF (D3/D4) per G.733, ESF per AT&T CB142, per ITU-T G.704 with CRC-6 |
| STS-1 INTERFACE | |
| Line Rate | STS-1 at 51.84 Mbps |
| SPE Mappings | 28 DS-1s, 1 DS-3 |
| STS-1 Framing | Per Telcordia GR-253-CORE |
| DS-1 Payload Framing | SF (D3/D4) per G.733, ESF per AT&T CB142, per ITU-T G.704 with CRC-6 |
| OC-3 INTERFACE | |
| Line Rate | OC-3 at 155.52 Mbps |
| SPE Mappings | 28 DS-1s, 1 DS-3 |
| OC-3 Framing | Per Telcordia GR-253-CORE |
| DS-1 Payload Framing | SF (D3/D4) per G.733, ESF per AT&T CB142, per ITU-T G.704 with CRC-6 |
| Optical Interface | 1310nm single mode fiber, LC style connectors Short/Intermediate Reach |
| STM-1 INTERFACE | |
| Line Rate | STM-1 at 155.52 Mbps |
| STM-1 Framing | Per ITU-T G.707 |
| E1 Payload Framing | CAS, CAS + CRC4, per ITU-T G.704 |
| Optical Interface | 1310nm single mode fiber, LC style connectors Short/Intermediate Reach |
| SYNCHRONIZATION | |
| Dual BITS clock inputs Line timing from any input Local oscillator (ST3/TNC clock) |
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| NETWORK INTERFACE | |
| Line Encoding | AMI-B7, B8ZS, Bipolar AMI HDB3 per ITU-T G.703, G.704 |
| PCM Encoding | A-law or µ-law Segmented µ-255, A-law per ITU-T G.711 |
| Jitter Tolerance | Per AT&T 62411, GR-499-CORE, GR-253-CORE |
| Signaling | E1: CAS, CCS, Q.50 (AB/CD) T1: CCS (C6, C7), RBS (E&M, PLR, FXS-GS, FXO-GS, FXS-LS, FXO-LS) |
| Connectors/Cabling | BNC unbalanced 75 Ohm connectors 450 feet (138m) 75 Ohm coaxial cable Balanced 100/120 Ohm BITS clocks AT&T 728, 734, or equivalent |
| REDUNDANCY | |
| A & B power: –39 to –60 VDC Electrical per GR-499-CORE Optical APS per GR-253-CORE Fans alarmed; no single fan critical Telco Flex cards 1:1 spared ECR Flex cards 1:3 spared Auto-switching to standby cards Hot-swappable |
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| MONITORING | |
| Alarm Monitoring | Per GR-499-CORE, GR-253-CORE, ITU-T G.707 Dry contacts for Alarms and E2A Interface |
| Performance Monitoring | Referencing ANSI T1.231-1997 |
| FRONT PANEL CONTROL | |
| Push button for alarm cutoff (ACO) LEDs indicate power, major, minor, facility, maintenance, and equipment alarms |
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| TERMINAL CONTROL | |
| Serial Interface | RS-232/V.24 port for each Telco Flex card Data transfer selectable to 38400 baud |
| LAN 10/100Base-T | Backplane port for each BVP Flex system TCP/IP address per BVP Flex system |
| Local and Remote Provisioning | Local: CLI, NetConsul™ CST GUI Multisite: NetConsul EMS |
| PHYSICAL ATTRIBUTES | |
| Dimensions (H x W x D) | Shelf (10 RU): 17.5 x 17.3 x 13.3 inches (445 x 440 x 340 mm) Mounts for 19″ or 23″ ANSI/EIA, 600 mm ETSI racks |
| Weight | Empty shelf (with fans): 45 lbs (20 kg) Shelf with 1 BVP Flex system: 53 lbs (24 kg) Fully loaded shelf: 72 lbs (33 kg) Telco Flex card: 1.4 lbs (0.6 kg) ECR Flex card, 1 DSP module: 1.5 lbs (0.7 kg) |
| CAPACITY | |
| 1 OC-3/STM-1, 3 DS-3/STS-1 per BVP Flex system 3 BVP Flex systems per shelf (3 OC-3 equivalents or up to 6,048 DS0s) 4 BVP Flex systems per 7-foot rack (12 OC-3 equivalents or up to 24,192 DS0s) |
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| ENVIRONMENTAL | |
| Operational | Temperature: 5° to 40°C Short Term: –5° to 55°C Humidity: 5 to 90%, non-condensing |
| Non Operational | Temperature: –40° to 70°C Humidity: 5 to 95%, non-condensing |
| Heat Output | Full f600 shelf: 2100 BTU/hour Full f400 shelf: 1800 BTU/hour Full f200 shelf: 1500 BTU/hour Full f100 shelf: 1300 BTU/hour |
| RELIABILITY | |
| MTBF Per Telcordia SR-332 Issue 1 May 2001 |
Telco Flex card: 33 years at 40°C ECR Flex f600 card: 25 years at 40°C ECR Flex f400 card: 29 years at 40°C ECR Flex f200 card: 34 years at 40°C ECR Flex f100 card: 37 years at 40°C |
| REGULATORY INFORMATION | |
| UL 60950 / EN 60950 CAN/CSA-C22.2 EN 300 386-1 and -2 EN 55022 (CISPR 22) Class B EN 55024 FCC part 15 Class A CE Mark Telcordia GR-1089-CORE NEBS Level 3 per Telcordia SR-3580 RoHS 5/6 |
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